SMT Red glue series

    -----Red glue is a poly dilutes compounds, heat curing .The adhesive hardening agents, pigments, solvents, etc., evenly distributed in the red glue. Mainly used for the components fixed on the printed board, General applies dispensing or stencil printing method to allocate. Paste components put in the oven or reflow welding with heat-curing. The red glue heat curing process is not reversible.
    Products introduce list:
    3609 - Is a one-component heating curing epoxy adhesive, Agent for the adhesive before wave soldering SMD components on the circuit board. 
               This product is a low temperature curing adhesive, suitable for high speed dispensing machine, excellent adhesive property, heat resistance 
               and stability at room temperature, Recommend curing conditions is 150 degree Celsius / 60 s.
    3630 -  Is a one-component heating curing epoxy adhesive, Agent for the adhesive before wave soldering SMD components on the circuit board. 
               This product is a low temperature curing adhesive, suitable for high speed dispensing machine, excellent adhesive property, heat resistance 
               and stability at room temperature, Recommend curing conditions is 100 degree Celsius / 120 s.