Underfill adhesive series

    ----- Reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
    Products introduce list:
    8505 - Unit of epoxy resin,reworkable epoxy underfill designed for PC,AIO,NB M/B's BGA or CSP assembly applications.
    8513 - Unit of epoxy resin,reworkable epoxy underfill designed for PC,AIO,NB M/B's BGA or CSP assembly applications.
    8517 - Unit of epoxy resin,reworkable epoxy underfill designed for Phone,MP4,MP5,
               PDA, PAD assembly applications.
    8581 - Unit of epoxy resin,reworkable epoxy underfill designed for Phone,MP4,MP5,
               PDA, PAD assembly applications.
    8586 - Unit of epoxy resin, reworkable epoxy underfill designed for server,TV,other biggish BGA or CSP assembly applications.